The Koch Chemie Micro Cut Pad is made from high-quality specialised sponge designed to remove fine scratches, holograms, and polishing marks in collaboration with Koch Chemie M3 Micro Cut Compound. The short height of 23mm creates low torsion forces whilst providing a high level of stability and excellent handling. The unique density of the foam enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count provides a high level of abrasiveness and increases the lifespan of the pad. The milling edge enables increased flexibility, allowing them to move around contours more easily.
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